I reheated the existing IC using an SMD rework heatgun which I know the temperature of the heatgun.
Apply flux generously before re-flowing.
1. Warm up the IC area at ~200C for 2 mins.
2. Heat the IC area at ~250C for 2 mins.
3. Reflow the IC at ~300C for 30-45 secs.
4. Use a pencil (I used a strong toothpick ) to put pressure on the audio IC as you cool down the IC area for at least 5 mins with cool air.
Those are the hot air temp so it will be cooler when it hits the IC/board (nozzle >15mm above the IC).
PS: I also used this technique to fix the RROD on XBOX 360 and YLOD on PS3 but with longer heating times due to the board thickness and IC size
Only had to heat the component side due to the thin board (steps 1-3).
It is recommended to cool the board quickly to stop crystallization (i think). Just use a hair dryer on cool setting and don’t bump the board
I did not remove the epoxy